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Category: Welding equipment and toolsDescription: Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes45065+$27.208450+$26.0456200+$25.3945500+$25.23171000+$25.06892500+$24.88295000+$24.76667500+$24.6503
